Double-Sided Hot Embossing of Microstructures

M. Heckele1), H. Dittrich1), A. Guber1), T. Schaller2)

1) Forschungszentrum Karlsruhe, IMT
2) Forschungszentrum Karlsruhe, HVT
Postfach 3640, D-76021 Karlsruhe

Low-cost production of mechatronic devices is achieved by thermoplastic molding of miniaturized mechanical components in a batch process. Replication of most delicate microstructures is achieved by hot embossing. We expanded the range of application by introducing double-sided hot embossing in order to increase the functionality of the polymer microcomponents. By this way we realized thin through holes in microvalve housings and hollow needles.